Mold for flat packing



May 23, i933. P. w. DEMPSEY MOLD FOR FLAT PACKING Filed Dec. 2, 1929INVENTQR PHILIP W. DEMFSEY ,7%. di@ ATTQRNEY Patented May 23, 1933 STESA ETE PHTLIL W. DEMPSEY, OF PITTSBURGH, PENNSYLVANIA, ASSIGNOR T THEWESTING- HOUSE AIR BRAKE COIYPANY, 0F WILMERDING, PENNSYLVANIA, ACORPORATION OF PENNSYLVANIA MOLD FOR FLAT PACKING Application filedDecember 2, 1929.

This invention relates to packing molds, and more particularly to a moldtor flat packing.

@ne object ol my invention is to provide a mold for packing having meansfor disposing of excess material iowing from the packing when thepacking being pressed in the mold, so to provide a more uniform packing.

Another object of the invention is to provide an improved method ofhandling the molds, so as to facilitate and reduce the cost of makingmolded packing.

Other objects and advantages will appear in the iiollowiinel moredetailed description of the invention.

in the accompanying drawing, the single figure is a central sectionalView of a packing mold assembly embodying my invention.

Each mold may comprise a plate l, preferably of heat-treated steel,provided at one 'lace with a recess corresponding with the contour ofthe packing 2, such as a circular contour. li the packing has a centralopening, the plate l is provided with a central bore in wiich a plug 3is secured, said plug being` adapted to extend into the opening of thepacking 2.

Adjacent to the periphery of the recess containing the packing, theplate l is provided on its tace with a shallow annular groove 4 andadjacent to the groove l a larger annular groove 5 is provided. Aplurality of atmospheric vent openings 6 extend through the plate 'fromthe groove 5.

i plate 7, preferably o hardened tool steel is also provided, and inoperation, the roughly formed packing 2 is placed in the mold l, and theplate is then applied to the face of the mold. Another mold l with apacking 2 disposed therein is then applied inverted, to the upper faceof the plate 7, in the manner shown in the drawing.

rlfhe assembly of molds is then placed in a suitable press (not shown)and pressure is f applied to the molds, so as to press the packings inthe molds. Excess material flowing Irom the packmgs in the molds, [lowsinto the shallow grooves 4, and 1f the shallow grooves should becomefilled with excess material,

Serial No. 410,969.

further excess iiows into the larger grooves 5.

Any produced in the packing when the molds are subjected to pressure,can escape by way ot the vent passages 6.

Vfhere the packing is relatively small, each mold may be provided with anumber of recesses to receive a corresponding number of packings, aswill be evident.

While one illustrative embodiment of the invention has been described indetail, it is not my intention to limit its scope to that embodiment orotherwise than by the terms of the appended claims.

Having now described my invention, what l claim as new and desire tosecure by Letters Patent, is:

A mold for packing comprising a plate having` a recess in one :tace toreceive the packing, a shallow annular groove in said tace adjacent tothe periphery of said recess and another annular groove in said face,adjacent to the shallow groove.

In testimony whereof I have hereunto set my hand, this 27th day ofNovember, 1929.

PHILIP lV. DEMPSEY.

